Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules

ABSTRACT

An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.

CROSS REFERENCE TO RELATED APPLICATION

There are no related applications.

TECHNICAL FIELD

This invention relates to a three-dimensional packaging and coolingsystem for mixed signal and mixed power density electronic modules.

BACKGROUND OF THE INVENTION

Many common electronics applications today utilize mixed signalelectronics with Digital, Analog, and Radio Frequency devices andcircuits contained on a single functional board or module. Successfuloperation of such electronics requires that various components beadequately cooled to prevent overheating, and while still providingadequate shielding to prevent Electromagnetic or Radio FrequencyInterference (EMI/RFI).

These two requirements post significant challenges when frequencies andpower densities of individual components in the module are mixed. Inmany cases, some devices may preferably operate at frequencies that areorders of magnitude different than others. For example, today'scomputers are operating at clock speeds at frequencies beyond 1 GHz,while bus speeds and memory speeds are on the order of 100 MHz and localswitch mode power converters or regulators operate in the KHz or low MHzrange. The power densities of various components can also vary by ordersof magnitude, with high power RF amplifiers or advanced microprocessorsin the 100 W/cm² range, while other devices operate on the order of 1W/cm².

The traditional method for packaging and cooling such modules is toutilize two-dimensional, planar packaging with forced air convection andconduction cooling methods. Low power density circuits are typicallycooled by forced air convection where the thermal path is through thetop sides of the component packages. High power devices typicallyutilize attached heat sinks. In mixed signal applications, differentparts of the circuit must be isolated from each other to preventElectromagnetic or Radio Frequency Interference (EMI/RFI) from adverselyinfluencing the circuit performance. One conventional approach forexample for accomplishing this is to segment the circuit card intosections bordered by a ground strip and place a cover containingmultiple cavities on top of the board to mate with the ground strips tocreate a multiple cavity isolated board. This prevents the use ofconventional forced air cooling approaches as described above because noair can be circulated through adjacent cavities without violating theeffectiveness of the shield. Consequently, most mixed signal modules arecooled by conducting heat from the devices, through the board and into afinned metal heat sink. Higher power devices are typically mounteddirectly to the heat sink by making a rectangular “hole” through theboard.

This traditional method of packaging and cooling is relativelyexpensive, yields lower reliability, and will be increasingly difficultto effectively utilize in future systems as frequencies and powerdensities increase. There are three reasons that this approach isexpensive. First, the large board sizes utilized to accommodate multiplecircuit types/functions on a single card are very complex and moreexpensive to manufacture. Next, the packaging utilized at the devicelevel to reduce thermal resistance through the card or into the heatsink is expensive because of the requirement to use high conductivitymaterials with matched coefficients of thermal expansion. Finally, themechanical parts are complex and require high manufacturing tolerancesand complicated assembly. Many of the devices utilized are actuallydesigned to be cooled from the top side, not through the device packageand the board. The thermal path through the card has high thermalresistance, consequently yielding high junction temperatures and poorreliability. As these systems move towards the increased use of highperformance digital electronics, this method of packaging and coolingwill be increasingly difficult to accommodate without furtherexacerbating the reliability problem because of the trend of increasingpower density at the component level.

To alleviate these problems, a new cooling technology which provides theelectronics with dielectric fluid has been proposed and described inseveral patents. The apparatus and method described in U.S. Pat. No.5,675,473 illustrates the introduction of spray cooling into atraditional multi-cavity, two-dimensional board type of packagingapproach described above. While this packaging and cooling approach willindeed provide shielding and improved reliability due to reducedtemperature operation as described, this approach will be difficult andcostly to implement in practice.

A reason that this method will increase cost is that spray coolingrequires the volume flux of spray applied to the electronic componentsto be matched to the heat flux distribution of the components.Otherwise, cooling performance and device reliability are compromised.Proper cooling is only achieved if a thin liquid film is maintained overthe device. If there is too little flow, the liquid layer covering theelectronic component will dry out and cause the component to overheat.If the flow to the component is too high, the device will becomeflooded, and this may reduce the cooling efficiency. Vapor generated atthe surface of the component cannot escape effectively and could resultin a boiling heat transfer failure mode called burnout.

Even when the volume flux of coolant is properly matched to the heatflux of the device, the excess fluid sprayed within a cavity must bemanaged, for example, by the method described in U.S. Pat. No.5,220,804, which prevents or reduces the overflow from adjacentcomponents from interfering and causing flooding type failureconditions.

Thus, the method proposed in U.S. Pat. No. 5,675,473 which describes asingle manifold plate that incorporates all of the fluid distributionand return passages and spray hardware would be relatively costly andalso exhibit lower than desired yield. Any change to any part of thecircuit design will require the use of a new plate assembly toaccommodate the required changes to the atomizer array and the fluidreturn passage designs. Similarly, the failure of any part of thedesign, on either the card or in the fluid distribution plate requiresthe entire assembly to be replaced. This type of fluid system would alsobe very difficult to design for effective operation, due primarily tothe need to design a properly balanced two-phase fluid distributionsystem. With all of the different segments supplied via the samemanifold any change in flow rate to a given section alters the pressuredrops within the distribution manifold, and consequently may change thedischarge pressure in adjacent atomizer groups. This also alters thespray characteristics and flow rates. A worse problem may occur on thefluid return manifold side. A high power density cavity with higher flowrate and high vapor mass fraction will yield a high momentum flow in theexit channel. If this exit channel is in direct communication with alower power density, lower flow rate cavity, the exit flow from the lowpower cavity may be impeded, and possibly even backflow, resulting in aflooded operating condition.

The present invention is directed towards one of its objectives namelyto provide an improved apparatus and method for 3-dimensional packagingand cooling of mixed signal, mixed power density electronic modules.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a perspective cutaway view of one embodiment of the invention,showing a combination of a transverse spray module, an angled spraymodule and a direct impingement spray module;

FIG. 2 is a bottom perspective partial cutaway view of one embodiment ofa direct impingement spray cooling module which may be utilized as partof this invention;

FIG. 3 is a bottom perspective partial cutaway view of one embodiment ofan angled spray module which may be utilized in this invention; and

FIG. 4 is a perspective sectional view of an embodiment of a transverseor narrow gap evaporative spray cooling system which may be utilized aspart of this invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Many of the fastening, connection, manufacturing and other means andcomponents utilized in this invention are widely known and used in thefield of the invention described, and their exact nature or type is notnecessary for an understanding and use of the invention by a personskilled in the art or science; therefore, they will not be discussed insignificant detail. Furthermore, the various components shown ordescribed herein for any specific application of this invention can bevaried or altered as anticipated by this invention and the practice of aspecific application or embodiment of any element may already be widelyknown or; used in the art or by persons skilled in the art or science;therefore, each will not be discussed in significant detail.

The terms “a”, “an”, and “the” as used in the claims herein are used inconformance with long-standing claim drafting practice and not in alimiting way. Unless specifically set forth herein, the terms “a”, “an”,and “the” are not limited to one of such elements, but instead mean “atleast one”.

FIG. 1 illustrates a partial cutaway cross section perspective view ofan embodiment of this invention wherein there is a transverse narrow gapspray cooling module 103, an angled spray cooling module 102 and adirect impingement spray cooling module 101. The three-dimensionalcooling and packaging illustrated in FIG. 1 is one example of a packagewhich is more compact and effective than those in the prior art whereall of the electronic componentry on the circuit board was on onecircuit card and multiple pockets for sealing are provided. In theembodiment shown, the EMF or other signal shielding to prevent thesignal from one electronic component to interfere with the signal fromanother is provided by the material in the modules, which is typicallymetallic. Although in many applications the interfering or potentiallyinterfering signal tags are going to be dissimilar, there will be somesituations where the first signal type will be the same as the secondsignal type but still be interfering.

The direct impingement module 101 includes inlet 132, framework 112,first circuit card cavity 114 with first circuit card 111 positionedtherein, with electronic modules 123 mounted on first circuit card 111.The second circuit card 119 includes electronic modules 125 mountedthereon and the second circuit card with electronic modules is mountedwithin second circuit card cavity 113 within direct impingement module101. Although the direct impingement module 101 is shown with twocircuit card cavities, any number of circuit card cavities, one orabove, may be utilized as contemplated by this invention.

The direct impingement module 101 includes a plurality of atomizer banks120 with atomizer nozzles 121 in the second circuit card cavity 113. Theatomizer banks 122 in the first circuit card cavity 114 are directed inthe opposite direction and would spray on electronic modules 123 mountedon first circuit card 111 within first circuit card cavity 114. Thiswould be referred to as a two-sided or dual-sided direct impingementspray module.

There may be one or more electronic components on first circuit card 111or second circuit card 119 which are potentially interfering with theelectronic components on another circuit card if the electroniccomponents emit an interfering signal type. One of the embodiments ofthis invention contemplates a first signal type emitted from anelectronic component on one circuit board and a second signal typeemitted from an electronic component on a second circuit board, whereinthe first signal type interferes or potentially interferes with thesecond signal type.

To give a few examples but not by way of limitation, the first signaltype may be a digital signal type and the second an analog signal type,or the first signal type may be analog and the second signal type radiofrequency. It will be appreciated and known by those of ordinary skillin the art that any one of a number of different signal types andcombinations of signal types may be utilized in embodiments or aspectsof this invention.

As stated above, there may also be interference between two like orsimilar signal types which it may be desirable to prevent. In manycases, the signal types would be attenuated or shielded from one anotherby the spray modules and atomizers therebetween and additional shieldingmay not be necessary, depending upon the nature and type of the signaltypes involved. If additional shielding is required, it may be insertedon the exterior of a module between the dual sides of a two-sided directimpingement module. In many cases, a metal shield will suffice but theremay be specialty applications in which metal is not necessary and otherstypes of materials may work more effectively. There is no one particularmaterial or type required to practice this invention.

It will also be appreciated by those of ordinary skill in the art thatthe shield would not completely cover an area between two circuit cardsor electronic components, but in some situations partial shielding maybe as effective to prevent interference between the first signal typeand a second signal type. It will also be appreciated by those ofordinary skill in the art that the packaging shown in FIG. 1 for exampleis a fully enclosed closed system in its entirety, although only thecutaway portion is shown.

FIG. 1 also illustrates angled spray module 102, which includes moduleinlet 131 for receiving cooling fluid, framework 140, plurality ofangled spray heads 150 with atomizer nozzles 151 therein. The angledspray heads 150 are positioned relative to electronic components 126 onthird circuit card 129. Third circuit card 129 is mounted within thirdcircuit card cavity 115.

FIG. 1 further shows transverse or narrow gap spray module 103, whichincludes coolant inlet 130, framework 141, spray heads 160, spraynozzles 161 mounted transverse to the electronic modules 124 mounted onthe second side of third circuit card 129. Fourth circuit card 127includes electronic components 128 mounted thereon and which alsoreceive spray cooling from atomizer nozzles 161, transverse spraycooling for thin film evaporative spray cooling of the electroniccomponents 128.

FIG. 1 also shows outer housing 110 mounted to fourth circuit card 127and electronic connector 140 which is electronically connected and incommunication with the circuit cards to provide a mode of electronicinput and output of signals thereto and therefrom. It will beappreciated by those of ordinary skill in the art that the particularelectronic connector type may be any one of a number of different types,depending on the application, and no one in particular is required topractice this invention. The atomizer nozzles 161 are located withinatomizer plate 160; however, it will be appreciated that any one of anumber of different types of atomizers may be transversely mounted toaccomplish the spray cooling contemplated herein, with no one inparticular being required to practice the invention. There may bebutton-type atomizers, laminated plates or any other.

For purposes of this invention, although only one of the numerouspossible embodiments of the housing is shown, it will be appreciated bythose of ordinary skill in the art that the invention is not limited tothe one embodiment shown. For instance, aspects or embodiments of thesystem may be in one small part of a larger housing, depending on theapplication. In further or sub-embodiments of the larger housing, thoseof ordinary skill in the art would In another aspect, a system may beprovided which is configured to receive the electronics to be cooled inan interchangeable fashion such as by edge card connectors, depending onthe cooling requirements.

FIG. 2 is a bottom perspective partial cutaway view of one embodiment ofa direct impingement spray module which may be utilized in thisinvention, in which the atomizers are generally oriented in the samedirection as opposed to in opposite directions as shown in the directimpingement spray module 101 shown in FIG. 1. FIG. 2 illustrates adirect impingement spray module 200 with housing 210, coolant inlet 212,bottom coolant outlet 213, and a plurality of atomizer plates 203 on thefirst level. The atomizer plates 203 (preferably but not necessarilylaminated) shown each include nine spray patterns 204 which would, bespraying on electronic modules on a circuit card adjacent thereto.

A second set or layer of atomizer plates 201 with atomizer nozzles 202is also shown in FIG. 2 and would be spray cooling by direct impingementthe second circuit card mounted in a cavity adjacent thereto. A directimpingement atomizer nozzle generally sprays at approximatelyperpendicular from the electronic component, and coolant would generallyflow in all directions off the electronic component, as opposed totransverse spray cooling which is generally only in one direction andwherein the atomizer nozzles are mounted generally transverse to theimpingement surfaces.

FIG. 3 is a bottom perspective view of one embodiment of an angled spraycooling module 300, illustrating coolant inlet 303, coolant outlet 302,framework 301, inlet coolant conduit 312 connecting to atomizer conduits311 and providing coolant to a first angled atomizer plate 304, secondangled atomizer plate 306 and a third angled atomizer plate 308. Spraypattern 305 originates from first angled atomizer plate 304, secondspray pattern 307 originates from second angled atomizer plate 306, andthird spray pattern 309 originates from third angled atomizer plate 308.

It will be appreciated by those of ordinary skill in the art that thespecific spray pattern for each will depend on the circumstances and anyone of a number of spray patterns may be utilized to accomplish theresults, depending on the circuit card cavity configuration anddimensions and the location and nature of the electronic components onthe circuit card to be cooled. Circuit card mounting surface 313 shows asurface which may be utilized to mount to and against the circuit cardwhich includes the electronic components to be cooled, while item 314shows an area cutaway in cross section within the framework 301, forillustrative purposes.

FIG. 3 further shows a signal shield 320 which may be in plate formmounted on the side of a spray cooling module 300 such as this. Thesignal shield 320 may be utilized to shield a first signal type emittedfrom an electronic component on a circuit card within the angled spraymodule cooling cavity from the second signal type from an electroniccomponent mounted in an adjacent circuit card cavity. As stated above,the material may be metal or any one of a number of different types ofmaterials which are effective or desired for shielding signals. In otherembodiments, the spray modules themselves act as the signal shield and aseparate layer, shield or plate is unnecessary.

FIG. 4 is an embodiment of a transverse spray module 400 which may beutilized by this invention, illustrating framework 401, circuit cardinterface surface 410, fluid coolant inlet 403, coolant outlet 402, andspray patterns 404 with a flatter side 405 to improve spraycharacteristics for the narrow gap 407 cooling cavity.

It is oftentimes desired in embodiments of the invention to obtain amore uniform or as uniform coverage as possible of coolant on theelectronic components to be cooled. During the normal course: ofcooling, without other design features included, all of the vapor thatis generated during the cooling process from the evaporation and otherfactors, and all of the unused liquid, generally must exit the system.In many cases and configurations, the spraying of coolant from theatomizers is an effective vapor pump and creates a low pressure zone inor near the inlet area, as compared to the pressure zone at the outletarea. This may be referred to as an adverse pressure gradient. Sincefluid, including vapor, tends to flow from high pressure to low pressureand high pressure tends to develop toward the exit area, the conflictdevelops and eddies tend to develop in the corners near the inlet orspray atomizers as the vapor tends to move back toward the low pressurearea or zones at or near the atomizers or spray coolant inlet, which isthe spray side or the entrance side of the circuit card or cavity inwhich the electronic components are housed or contained. Interfacialdrag of vapor and/or liquid and thin liquid creates a drag or pull onthe liquid which is on the impingement surface or surface of theelectronic components.

When the eddies described above occur and sometimes increase instrength, they have the potential to completely block off or alter thespray pattern originally obtained and desired. This may alter the heattransfer, thin film evaporation and the cooling capacity of the spraycooling system. This results in more spray coolant being provided to theelectronic components nearer the spray side and less or inadequatecoolant being supplied to the electronic components nearer the exitside, and some may not get any appreciable coolant.

In order to reduce or eliminate this problem, this invention utilizes atechnique which may be referred to as “vapor recirculation”. There maybe any one of a number of embodiments of vapor recirculation which maybe utilized by this invention. One way for instance is to provide anopening or openings near the exit side of the circuit card or coolingcavity, the apertures or openings being configured to allow vapor toflow therethrough while impeding the flow of liquid. One way to helpkeep the liquid out or reduce the liquid which is the eddying in theexit vapor openings is to provide the openings with a large enoughcross-sectional area that the entering vapor has a low velocity and doesnot entrain liquid or draw the liquid into the openings. It is alsopreferable, although not necessary, that the openings are at leastinitially near perpendicular or more to the direction of travel of theliquid or even in the opposite direction of the liquid, as liquid doesnot tend to turn as easily as vapor when flowing. While it would be verydifficult to prevent nominal amounts of spray coolant liquid to becomeentrained, additional precautions may be taken to avoid re-introducingnon-atomized liquid.

The vapor may then be routed back toward the spray or inlet side whereit is introduced through one or more apertures or openings and providesa vapor velocity to partially or wholly prevent the eddying or backfloweffect. If the vapor recirculation conduits are large enough incross-section, the vapor velocity is reduced and it tends not to draw orentrain as much liquid back toward the inlet area where the vapor isbeing redirected. In this case no shroud is used to control the fluidbut instead the vapor in the system is partially gathered and routedback to or toward the entrance side or the spray side of the coolingcavity or circuit card.

An alternative vapor recirculation system may involve sizing the coolingcavity so wide that the vapor can be recirculated at the far side ofsuch a wider cavity at a low enough velocity within the side channels sothat liquid would not be entrained and eddies would not develop. This isnot preferable in applications in which size is more important becauseof obvious size constraints, and further this type of vaporrecirculation system may tend to lower heat transfer coefficients. In anarrower channel application of the vapor recirculation system, thehigher vapor velocities assist in spreading the cooling liquid orcoolant and in thinning or reducing the depth of the liquid film overthe electronic components.

It will be appreciated by those of ordinary skill in the art that thespecific velocities and thickness of coolant or liquid being evaporatedvaries from application to application and no one in particular isrequired to practice this invention.

Another potential vapor recirculation system is to materially increasethe amount of coolant that is sprayed and to widen the array ofatomizers which provide the atomized coolant to the cooling cavity. Thiswould have the effect of impinging heavily on all of the channelsurfaces and, in effect, overpower the vapor trying to backflow or eddy.This embodiment is not preferred in many applications because itrequires a substantially higher flow rate of coolant and one atomizerwhich becomes weak or inoperative will cause a failure of a systembecause a super low pressure region would then be created where thefailure occurred.

The typical and preferred coolant utilized with spray in this inventionis fluorinert™, available from 3M. However, this invention is in no waylimited to any one particular coolant, as there are many others whichmay be suitable dielectric coolants, such coolants being known andavailable in the industry.

Although the invention is certainly not limited to any particular rangefor cooling, under current practice in cooling, the following method isutilized to design an apparatus according to the present invention.First, the individual circuit cards are analyzed according to theindividual device size, power distribution and layout to determine themost desirable spray configuration. Based upon the maximum device heatflux of the individual components, geometry constraints, and the totalboard power level and size, the narrow or transverse spray, angledimpingement, or normal impingement spray configuration is chosen. Thefollowing table serves as a general guideline (not a limitation) forspray cooling with perfluorcarbons.

Con- figuration Max. Device Flux Avg. Board Flux z-axis space Narrow Gap 20 W/cm² 20 W/cm² 0.02″–0.25″ Angled  40 W/cm² 30 W/cm²  0.25″–0.375″Impingement Normal 150 W/cm² 50 W/cm² 0.25″–0.75″ Impingement Enhanced1.5–10.0 × Normal 1.5–10.0 × Normal 0.25″–1.0″  Surface

There are other possible embodiments to this invention which may havebenefits such as cost reduction, elimination of diamond processing, andimprovement of the performance potential, although none of these arerequired to practice the core invention disclosed herein. Recent coolingstudies concerning spray cooling in narrow gaps suggests that a higherperformance approach is possible by actually spraying through thecomputer, rather than relying on costly thick diamond to conduct theheat to the edge. Experiments demonstrate the ability to remove fivehundred (500) Watts per board while accommodating the required boardpitch.

There are also multiple electromagnetic interference (EMI)-attenuatingmaterials which may be utilized as a signal shield, such as metal andothers. These also are known in the art, and the specific composition ornature of the shield may vary greatly with the application and thesignal type. For instance, carbon, iron and others may be used as EMIattenuating materials. It will also be appreciated by those of ordinaryskill in the art that the shielding may not need to cover 100% of thearea between the two electronic components to be shielded, but instead apartial sealing will suffice for the particular application. The systemscontemplated by this invention are preferably sealed systems, andnumerous methods, materials and other components are known in theindustry and will not therefore be discussed in significant detail.

Applicant hereby refers to and incorporates by this reference thefollowing U.S. patents: U.S. Pat. No. 5,675,473 issued Oct. 7, 1997;U.S. Pat. No. 5,220,804 for a high heat flux evaporative spray coolingsystem; and U.S. Pat. No. 5,860,602 and U.S. Pat. No. 6,016,969, eachfor a laminated array of pressure swirl atomizers. The laminated arrayof pressure swirl atomizer patents referred to above may be utilized asone way or mechanism to accomplish the atomizing, even though there arenumerous others which are available and now known in the art.

As will be appreciated by those of reasonable skill in the art, thereare numerous embodiments to this invention, and variations of elementsand components which may be used, all within the scope of thisinvention.

One embodiment of this invention, for example, is an integrated threedimensional packaging and cooling system for cooling an electroniccomponent system with dissimilar power densities and interferingsignals, the electronic component system including a first electroniccomponent with a first signal type and a second electronic componentwith a second signal type, wherein the first signal type interfere withthe second signal type, the system comprising: a system framework withat least one electronic connector mounted thereto, the at least oneelectronic connector including system input connections and systemoutput connections, the system framework comprising: a system housing; afirst circuit card cavity configured to house a first circuit card withthe first electronic component mounted thereon; a second circuit cardcavity configured to house a second circuit card with the secondelectronic component mounted thereon; a first signal shield between thefirst circuit card cavity and the second circuit card cavity, the firstsignal shield disposed to shield the first electronic component fromreceiving an interfering second signal type from the second electroniccomponent; a thin-film evaporative spray cooling system comprising: afirst spray module configured to provide spray cooling to the firstcircuit card; a second spray module configured to provide spray coolingto the second circuit card; wherein each of the first spray module andthe second spray module comprise a plurality of atomizers in fluidreceiving disposition to receive cooling fluid from a system coolingfluid supply, and each of the plurality of atomizers are oriented tospray cooling fluid on the circuit card corresponding to that spraymodule.

In further possible embodiments of the foregoing as stated in thepreceding paragraph, such an integrated system further: wherein thefirst spray module is integral with the second spray module and furtherwherein the plurality of atomizers of the first spray module spraycooling fluid in the opposite direction from cooling fluid sprayed bythe plurality of atomizers in the second spray module; wherein theintegral first spray module and second spray module also comprise thefirst signal shield; wherein the first spray module is one of: a normalimpingement type; an angled impingement type and a transverse spraytype; and/or wherein the first spray module is dissimilar to the secondspray module. The second spray module may but need not also be one of: anormal impingement type; an angled impingement type and a transversespray type.

In still other and further embodiments, the above mentioned integratedsystem (in the second preceding paragraph) may be further provided:wherein the spray module is also the first signal shield; wherein thefirst signal type is digital and the second signal type is analog;wherein the first signal type is digital and the second signal type isradio frequency; wherein the first signal type is analog and the secondsignal type is radio frequency; and/or wherein the first signal shieldis an electromagnetic-interference attenuating shield.

In another further embodiment, an integrated three dimensional packagingand cooling system may be provided as stated above, and which furthercomprises: a third circuit card cavity configured to house a thirdcircuit card with a third electronic component mounted thereon, thethird circuit card cavity being oriented to house the third circuit cardapproximately parallel relative to the first circuit card; a secondsignal shield between the second circuit card cavity and the thirdcircuit card cavity, the second signal shield disposed to shield thesecond electronic component from receiving an interfering third signaltype from the third electronic component; and wherein the thin-filmevaporative spray cooling system further comprises a third spray moduleconfigured to provide spray cooling to the third circuit card, andfurther wherein the third spray module comprises a plurality ofatomizers in fluid receiving disposition to receive cooling fluid from asystem cooling fluid supply, and each atomizer is oriented to spraycooling fluid on the third circuit card.

In further possible embodiments of the embodiment described in thepreceding paragraph, such an integrated system further: wherein thesecond spray module is integral with the first spray module and furtherwherein the plurality of atomizers of the second spray module spraycooling fluid in the opposite direction from cooling fluid sprayed bythe plurality of atomizers in the third spray module; wherein theintegral second spray module and third spray module also comprise thesecond signal shield; wherein the second spray module is one of: anormal impingement type; an angled impingement type and a transversespray type; and/or wherein the second spray module is dissimilar to thethird spray module. The third spray module may but need not also be oneof: a normal impingement type; an angled impingement type and atransverse spray type.

In still other and further embodiments to the second precedingparagraph, the above mentioned integrated system may be furtherprovided: wherein the second spray module is also the second signalshield; wherein the second signal type is digital and the third signaltype is analog; wherein the second signal type is digital and the thirdsignal type is radio frequency; wherein the second signal type is analogand the third signal type is radio frequency; and/or wherein the secondsignal shield is an electromagnetic-interference attenuating shield.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proer scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

1. An integrated three dimensional packaging and cooling system forcooling an electronic component system with dissimilar power densitiesand interfering signals, the electronic component system including afirst electronic component with a first signal type and a secondelectronic component with a second signal type, wherein the first signaltype interfere with the second signal type, the system comprising: asystem framework with at least one electronic connector mounted thereto,the at least one electronic connector including system input connectionsand system output connections, the system framework comprising: a systemhousing; a first circuit card cavity configured to house a first circuitcard with the first electronic component mounted thereon; a secondcircuit card cavity configured to house a second circuit card with thesecond electronic component mounted thereon; a first signal shieldbetween the first circuit card cavity and the second circuit cardcavity, the first signal shield disposed to shield the first electroniccomponent from receiving an interfering second signal type from thesecond electronic component; and a thin-film evaporative spray coolingsystem comprising: a first spray module configured to provideevaporative spray cooling to the first circuit card; a second spraymodule configured to provide evaporative spray cooling to the secondcircuit card; wherein each of the first spray module and the secondspray module comprise a plurality of atomizers in fluid receivingdisposition to receive cooling fluid from a system cooling fluid supply,and each of the plurality of atomizers are oriented to spray coolingfluid on the circuit card corresponding to that spray module.
 2. Anintegrated three dimensional packaging and cooling system as recited inclaim 1, and wherein the first spray module is integral with the secondspray module and further wherein the plurality of atomizers of the firstspray module spray cooling fluid in the opposite direction from coolingfluid sprayed by the plurality of atomizers in the second spray module.3. An integrated three dimensional packaging and cooling system asrecited in claim 2, and further wherein the integral first spray moduleand second spray module also comprise the first signal shield.
 4. Anintegrated three dimensional packaging and cooling system as recited inclaim 1, and further wherein the first spray module is one of: a normalimpingement type; an angled impingement type and a transverse spraytype.
 5. An integrated three dimensional packaging and cooling system asrecited in claim 1, and further wherein the first spray module isdissimilar to the second spray module.
 6. An integrated threedimensional packaging and cooling system as recited in claim 5, andfurther wherein the second spray module is one of: a normal impingementtype; an angled impingement type and a transverse spray type.
 7. Anintegrated three dimensional packaging and cooling system as recited inclaim 1, and further wherein the spray module is also the first signal.shield.
 8. An integrated three dimensional packaging and cooling systemas recited in claim 1, and further wherein the first signal type isdigital and the second signal type is analog.
 9. An integrated threedimensional packaging and cooling system as recited in claim 1, andfurther wherein the first signal type is digital and the second signaltype is radio frequency.
 10. An integrated three dimensional packagingand cooling system as recited in claim 1, and further wherein the firstsignal type is analog and the second signal type is radio frequency. 11.An integrated three dimensional packaging and cooling system as recitedin claim 1, and further wherein the first signal shield is anelectromagnetic-interference attenuating shield.
 12. An integrated threedimensional packaging and cooling system as recited in claim 1, andfurther comprising: a third circuit card cavity configured to house athird circuit card with a third electronic component mounted thereon,the third circuit card cavity being oriented to house the third circuitcard approximately parallel relative to the first circuit card; a secondsignal shield between the second circuit card cavity and the thirdcircuit card cavity, the second signal shield disposed to shield thesecond electronic component from receiving an interfering third signaltype from the third electronic component; and wherein the thin-filmevaporative spray cooling system further comprises a third spray moduleconfigured to provide spray cooling to the third circuit card, andfurther wherein the third spray module comprises a plurality ofatomizers in fluid receiving disposition to receive cooling fluid from asystem cooling fluid supply, and each atomizer is oriented to spraycooling fluid on the third circuit card.
 13. An integrated threedimensional packaging and cooling system as recited in claim 12, andfurther wherein the first signal shield is anelectromagnetic-interference attenuating shield.
 14. An integrated threedimensional packaging and cooling system as recited in claim 12, andfurther wherein the second spray module is integral with the third spraymodule and further wherein the plurality of atomizers of the secondspray module spray cooling fluid in the opposite direction from coolingfluid sprayed by the plurality of atomizers in the third spray module.15. An integrated three dimensional packaging and cooling system asrecited in claim 12, and further wherein the integral first spray moduleand second spray module also comprise one of the first signal shield andthe second signal shield.
 16. An integrated three dimensional packagingand cooling system as recited in claim 12, and further wherein the thirdspray module is one of: a normal impingement type; an angled impingementtype and a transverse spray type.
 17. An integrated three dimensionalpackaging and cooling system as recited in claim 12, and further whereinthe first spray module is dissimilar to the third spray module.
 18. Anintegrated three dimensional packaging and cooling system as recited inclaim 12, and further wherein the second spray module is also the secondsignal shield.
 19. An integrated three dimensional packaging and coolingsystem as recited in claim 12, and further wherein the first signal typeis digital and the third signal type is analog.
 20. An integrated threedimensional packaging and cooling system as recited in claim 12, andfurther wherein the second signal type is digital and the third signaltype is radio frequency.
 21. An integrated three dimensional packagingand cooling system as recited in claim 12, and further wherein one ofthe first signal shield and the second signal shield is anelectromagnetic-interference attenuating shield.